The Machine operates on suction principle of Abrasive Blasting. It incorporates highly engineered indexing turntable.
Synchronization of gun reciprocation and job rotation is through PLC. This Hi-tech synchronization produce a uniform non reflective finish and clean surface of Silicon Waffers.
Applications:
The surface finishing of critical component used in solar cell i.e. Silicon Waffer (Dia. 100-300 mm) is a very specialized task. Surface preparation of Silicon Waffer before etching and silver pasting is done to get better yield (wattage) from solar cell.
